ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,417, issued on April 1, was assigned to ZHEJIANG HIKSTOR TECHNOLOGY Co. LTD. (Hangzhou, China). "Storage array, and interconnection structu... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,786, issued on April 1, was assigned to Ningde Amperex Technology Ltd. (Ningde, China). "Negative electrode, and electrochemical apparatus ... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,267,102, issued on April 1, was assigned to Ciena Corp. (Hanover, Md.). "Prioritizing optical routes for restoration based on failure impact on... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,264,287, issued on April 1, was assigned to Phillips 66 Co. (Houston). "Pentane-enriched hydrocarbons to transportation fuel" was invented by C... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,777, issued on April 1, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Battery module including internal plate" was invente... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,268,082, issued on April 1, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Stretchable display substrate and manufacturing method th... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,042, issued on April 1, was assigned to SONY GROUP Corp. (Tokyo). "Image processing device and image processing method" was invented by Sei... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,263,981, issued on April 1, was assigned to Altria Client Services LLC (Richmond, Va.). "Apparatuses and methods for forming pouch product" was... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. D1,069,111, issued on April 1, was assigned to MDF Instruments USA LLC (Rincon, Puerto Rico). "Stethoscope tubing" was invented by Darren Talun Ch... Read More
ALEXANDRIA, Va., April 2 -- United States Patent no. 12,265,119, issued on April 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Repackaging IC chip for fault i... Read More